Mga produkto
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Bug-os nga Automatic Wafer Ring-Cutting Equipment Working Size 8inch/12inch Wafer Ring Cutting
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Mg-Doped LiNbO₃ Ingots 45°Z-Cut 64°Y-Cut Orientations Para sa 5G/6G Communication Systems
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6 Inch Conductive SiC Composite Substrate 4H Diameter 150mm Ra≤0.2nm Warp≤35μm
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Sapphire Optical Windows Single Crystal Al₂O₃ Na-customized nga pagsukol-sul-ob
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Laser Anti-Counterfeiting Marking Equipment Sapphire Wafer Marking
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LiTaO₃ Ingots 50mm – 150mm Diameter X/Y/Z-Cut Orientation ±0.5° Tolerance
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6 pulgada-8 pulgada LN-on-Si Composite Substrate Gibag-on 0.3-50 μm Si/SiC/Sapphire sa Materyal
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Sapphire Windows Optical Glass Customized Size Mohs katig-a 9
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Laser Anti-Counterfeiting Marking System para sa Sapphire Substrates, Watch Dials, Luxury Alahas
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Sapphire Crystal Growth Furnace KY Kyropoulos Method para sa Sapphire Wafer ug Optical Window Production
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6 pulgada nga Conductive single crystal SiC sa polycrystalline SiC composite substrate Diameter 150mm P type N type
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Taas nga Purity SiC Optical Lens Cubic 4H-semi 6SP Size Customized